—— 芯片百科 ——

描述

DESCRIPTION
Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. The package is designed to be used in an insulating medium such as resin, oil or SF6 gas.FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Soft-recovery switching characteristics
• Compact construction.APPLICATIONS
• For colour television and monitors up to 128 kHz
• High-voltage applications for:
– Multipliers
– Layer-wound diode-split transformers where controlled avalanche is required.

特性

应用

相关链接

—— 相关型号 ——

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—— 替代型号 ——

BY8104

导出替代信息

—— 购买渠道 ——

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