·Industry-leading long term stability (1.2 %RH over five years):
·Minimizes system performance issues
·Helps support system uptime by eliminating the need to service or replace the sensor during its application life
·Eliminates the need to regularly recalibrate the sensor in the application, which can be inconvenient and costly
·Industry-leading reliability (MTTF 9,312,507 HR): Thermoset-polymer capacitive sensing element's multilayer construction provides resistance to most application hazards such as condensation, dust, dirt, oil, and common environmental chemicals, which help provide industryleading reliability.
·Lowest total cost solution: Delivers the lowest total cost solution due to the sensor's industry-leading combined humidity/temperature sensor
·Combined humidity and temperature sensor: Allows the RH measurement to be temperature compensated, and provides a second, standalone temperature sensor output; allows the user to purchase one sensor instead of two
·Energy efficient:
·Low supply voltage: Can operate down to 2.3 Vdc, which allows use in low energy and wireless-compatible applications to enhance energy savings and prolong system battery life
·Low power consumption: The sensor goes into sleep mode when not taking a measurement within the application, consuming only 1 μA versus 650 μA in full operation in a battery operated system; sleep mode helps maximize battery life, reduces power supply size, and reduces the application's overall weight
·High resolution: High 14-bit humidity sensor resolution and 14-bit temperature sensor resolution within the application help the user's system detect the smallest relative humidity or temperature change
·True, temperature-compensated digital I2C or SPI output: Typically allows the customer to remove the components associated with signal conditioning from the PCB to free up space and reduce costs associated with those components (e.g., acquisition, inventory, assembly). True, temperature-compensated digital I2C or SPI output often eliminates problems that could occur from having multiple signal conditioning components across the PCB, as well as simplifies integration to the microprocessor, eliminating the need for customer-implemented, complex signal conditioning.
·Housing style: SOIC-8 SMD (Surface Mount Device) or SIP 4 Pin: ultra small size allows for flexibility of use within the application, occupies less space on the PCB, and typically simplifies placement on crowded PCBs or in small devices; industry standard design simplifies design-in
·Filter: Available with hydrophobic filter and condensation-resistance, allowing for use in many condensing environments, or without hydrophobic filter, non-condensing
·Tape and reel: Allows for use in high volume, automated pick-and-place manufacturing, eliminating lead misalignment to the PCB and helping the customer to reduce manufacturing costs
·Wide operating temperature range: Allows for use in many applications
·Optional one or two %RH level alarm outputs: Provides the ability to monitor whether the RH level has exceeded or fallen below predetermined and critical levels within the application
·Multi-function ASIC: Delivers flexibility within the application by lowering or eliminating the risk and cost of OEM calibration
·RoHS and WEEE compliant, halogen-free

Industrial:
·HVAC/R
·Air compressors
·Weather stations
·Telecom cabinets
·Incubators/microenvironmentsMedical:
·Respiratory therapy
·Incubators/microenvironments