—— 芯片百科 ——

描述

Overview
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data flash (1 KB × 2 blocks). The difference between the R8C/26 Group and R8C/27 Groupis only the presence or absence of data flash. Their peripheral functions are the same.

特性

应用

相关链接

—— 相关型号 ——

• R5F61642
• R5F10Y17A
• R5611
• R5F7142
• R5011ANX
• R5F7136
• R5F10266GNA-X0
• R5F36CA6DFA
• R5J64026LPFE
• R5F21247SN
• R5509-73
• R5F11768
• R5440N
• R5108
• R5000120

—— 替代型号 ——

R5F21262SDXXXFP

导出替代信息

—— 购买渠道 ——

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